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1. Layer scope:
2-30 layer PCB (rigid)
2. Materials scope:
FR - 4 (including high Tg and high CTE) ;High-frequency materials (including PTFE, PI, BT ,Rogers,etc);Metal materials;Embedded passive materials.
3. Processing scope:
Blind & buried PCB, Impedance control PCB, Heavy Cu PCB(up to 12oz), Embedded passive PCB, Rigid- flexible PCB,HDI Contains 0.5csp .
4. Surface treatment scope:
HASL,LF-HASL, ENIG , Imm Ag, Imm Tin,OSP, Flash gold ,Gold finger.
5. Application:
Telecommunication, Consumer Electronics,Network, Auto-mobile industry, Medical Equipment, Power, PC & periphery. | |
